As electronic devices become more powerful and compact, efficient heat dissipation is important for performance, safety, and longevity. Among the latest innovations in thermal interface materials (TIMs), Thermal gel for gap filling have gained attention for their ability to deliver consistent thermal conductivity while changing to demanding applications. https://caidenulcs14714.ttblogs.com/17303126/high-viscosity-thermal-gel-advanced-heat-management-for-electronics